Global 3D IC Market Report by Component Is Expected To Grow At The Rate Of More Than~17% From 2016 To 2022
March 20, 2017 in Uncategorized
Market Synopsis of 3D IC Market:
The growing semiconductor & microelectronics industry is developing a trend for vertically stacked integrated circuits (ICs) which is emerging as viable solution for providing high performance, increased functionality and reducing power consumption to fulfill electronic device requirements. These ICs are in great demand by military & aerospace, medical and consumer electronics industries to fulfill need of integrating disparate technologies which includes logic, memory, RF, sensor in small forms for industrial applications.
The major factor that drives the growth of 3D IC Market is growing high-end computing market; increasing need of 3D ICs in industries such as servers & data centers, military & aerospace, and medical sector and growing smartphone market is also driving the growth of 3D ICs market.
Globally the market for 3D IC Market is expected to grow at the rate of more than~17% from 2016 to 2022.
Segments for 3D IC Market:
Global 3D IC Market can be segmented as follows:
- Segmentation By technology:3D Wafer-level Packaging, 2.5 & 3D Interposer Based Integration, 3D Stacked ICs, Monolithic 3D ICs, 3D Heterogeneous Integration, and 3D System Integration.
- Segmentation By Components:Silicon Vias (TSVs), Glass Vias, Interposer.
- Segmentation By Products:Sensors, MEMS, Power & Analog Devices and Light Emitting Diodes.
- Segmentation By Application:Military & Aerospace, Medical, Consumer Electronics (Smartphones, Tablets, Gaming Device), Automotive, and Information and Communication Technology Among Others.
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Key Players for 3D IC Market:
Some of the major players in Global 3D IC Market include
- Intel Corporation (U.S.)
- Micron Technology, Inc. (U.S.)
- Qualcomm, Inc. (U.S.)
- IBM Corporation (U.S.), Xilinx, Inc. (U.S.)
- Amcor Technologies (U.S.)
- Tezzaron semiconductor Corporation (U.S.)
- Statschip PAC, Ltd. (Singapore)
- Monolithic 3D Inc. (U.S.)
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Study Objective of 3D IC Market:
- To provide detailed analysis of the market structure along with forecast for the next five years of the various segments and sub-segments of the global 3D IC Market.
- To provide insights about factors affecting the market growth.
- To analyze the 3D IC Market based on various factors- porters five force analysis, mega trend analysis, macroeconomic indicators etc.
- To provide historical and forecast revenue of the market segments and sub-segments with respect to four main geographies and their countries- North America, Europe, Asia, and Rest of the World (ROW).
- To provide country level analysis of the market with respect to the current market size and future prospective.
- To provide country level analysis of the market for segment by technology, by components, by product, by application, by regionand sub-segments.
- To provide strategic profiling of key players in the market, comprehensively analyzing their core competencies, and drawing a competitive landscape for the market
- To track and analyze competitive developments such as joint ventures, strategic alliances, mergers and acquisitions, new product developments, and research and developments in the global 3D IC Market.
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Regional Analysis of 3D IC Market:
Asia-Pacific is dominating the Global 3D IC Market with the largest market share due to emerging demand from growing consumer electronics market in the region and therefore is expected to grow with highest revenue by 2022. North-America is expected to grow as a second highest market after Asia-Pacific in the forecast period due to increasing demand of ICs in U.S. and Canada region.
- Consumer electronics vendors
- Data center service providers
- Communication industries
- Research and consulting firms
- Small and large enterprises
- Government agencies
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